| PART |
Description |
Maker |
| KTD2005 |
Low ON resistance 2.5V drive Mounting height 1.1mm Composite type, facilitating high-density mounting.
|
TY Semiconductor Co., Ltd
|
| LTV819-2M LTV819-1M LTV819-1S LTV-829S-TA1 LTV-819 |
High Density Mounting Type Photocoupler 2 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
High Density Mounting Type Photocoupler(484.24 k) 高密度安装类型光电耦合84.24十一
1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
|
Lite-On Technology, Corp.
LITE-ON ELECTRONICS INC
|
| PC829 PC849 |
High Density Mounting Type Photocoupler
|
SHARP[Sharp Electrionic Components]
|
| BL817 |
High Density Mounting Type Photocoupler
|
SeCoS
|
| HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
|
| HCPL-817 HCPL-817-0 HCPL-817-3 HCPL-817-5 HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type 光电晶体管光电耦合器高密度安装类型
|
TE Connectivity, Ltd.
Avago Technologies, Ltd.
Diodes, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
|
| LTV829 LTV-819 LTV819 |
(LTV-819 Series) High Density Mounting Type Photocoupler
|
LITE-ON Electronics
|
| PC817SERIES PC817 |
1 CHANNEL TRANSISTOR OUTPUT OPTOCOUPLER
High Density Mounting Type Photocoupler
|
Sharp Electronics Corp.
|
| EC2-6 EC2 EC2-12ND EC2-12NP EC2-12NU EC2-12NJ EC2- |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type
COMPACT AND LIGHTWEIGHT/ SMALL MOUNTING SIZE/ HIGH BREAKDOWN VOLTAGE
High Insulation/ High breakdown voltage/ compact and lightweight/ Surface mounting type
A/D Converter (A-D) IC; Resolution (Bits):24; Sample Rate:192kSPS; Input Channels Per ADC:8; Input Channel Type:Differential; Data Interface:Serial; Package/Case:48-LQFP RoHS Compliant: Yes
CONNECTOR ACCESSORY
Film Capacitor; Capacitor Type:Suppression; Voltage Rating:100VDC; Capacitor Dielectric Material:Polyester; Capacitance:0.022uF; Capacitance Tolerance: 10%; Lead Pitch:5.00mm; Leaded Process Compatible:Yes RoHS Compliant: Yes
COMPACT AND LIGHTWEIGHT, SMALL MOUNTING SIZE, HIGH BREAKDOWN VOLTAGE 小巧轻盈，小安装尺寸，高击穿电压
|
NEC Corp.
NEC, Corp.
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| TIL199A |
HIGH DENSITY MOUNTING PHOTODARLINGTON OPTICALLY COUPLED ISOLATORS
|
N.A.
|
| IS181 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
